| Focusing on quality & reliability, TDK remains a leader in Factory Automation solutions for both Front End & Back End applications. |
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AFM-15 Ultrasonic Gold-To-Gold Interconnect Process |
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The TDK AFM-15 Flip Chip Ultrasonic Gold-to-Gold Interconnect (GGI) Bonder provides a low temperature, precision, high reliability, die attach process.
The flip chip GGI die attach process provides up to a 70% form factor size reduction and superior electrical high frequency performance compared to other methods.
- What is the ultrasonic flip chip Gold-to-Gold Interconnect (GGI) process?
Click to learn more about the GGI process.
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TAS300 FOUP Load Port |
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The TDK TAS 300 series is the number one selling 300mm wafer load port that is demanded by top FABS. The TAS 300 is designed with TDK "clean technology" for contamination-free operation.
The TAS 300 opens architecture provides seamless integration to the OEM process tools.
Product Benefits:
- Industry Standard of excellence for reliability and quality
- Proven field reliability & low annual maintenance costs
- Open architecture to RFID providers
- FOUP interoperability
- Global support
Click here for product details.
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Other Factory Automation products include: |
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For more information on TDK's Factory Automation Solutions contact: |
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| TDK Factory Automation |
| 1221 Business Center Drive |
| Mount Prospect, IL 60056 |
| Tel: 847-795-2163 |
| Fax: 847-390-4410 |
| Or Send Email: |
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